Alchip Technologies recently showcased their advanced technology and chiplet design plans at the TSMC 2024 North America Technology Symposium held in Santa Clara, CA and Austin, TX. They also highlighted their expertise in high-performance computing design and discussed their success across multiple complex projects, including full reticle size designs over 800mm² on cutting-edge FinFET technology.
At the symposium, Alchip emphasized their industry partnerships, including membership with TSMC Open Innovation Platform® Value Chain Alliance and 3DFabricTM Alliance. The company has established itself as a high-performance ASIC leader through their advanced 2.5D/3DIC design, CoWoS/chiplet design, and manufacturing management capabilities.
Alchip Technologies is a global provider of silicon design and production services for system companies developing complex ASICs and SoCs. Founded in 2003 and headquartered in Taipei, Taiwan, they offer faster time-to-market and cost-effective solutions for SoC design at both mainstream and advanced process technology nodes. Alchip serves customers in various industries, including AI, HPC/supercomputing, mobile phones, networking equipment, and more.
For more information about Alchip Technologies or to contact them directly, visit their website at www.alchip.com or email Charles Byers at chuck_byers@alchip.com or call +1 (408)-310-9244.
