Japan-based Rapidus is working on developing 2nm process technology with the goal of commercializing it by 2027. To support its projects, the Japanese government has awarded Rapidus a significant grant totaling ¥590 billion yen ($3.89 billion). With this funding, Rapidus aims to achieve its ambitious goals and establish itself as a key player in the semiconductor industry.
The government’s support for Rapidus now amounts to ¥920 billion ($6.068 billion), providing a strong foundation for the company’s success. Despite an estimated cost of around ¥5 trillion ($32.983 billion), Rapidus is optimistic about securing the necessary financing with support from the Japanese government and major corporations like Toyota Motor and Nippon Telegraph and Telephone.
Rapidus plans to commence testing its production by April 2025, followed by large-scale production in 2027. Commercial production of 2nm chips is expected to begin in 2025. In addition to collaborating with IBM to develop the 2nm fabrication process, Rapidus is focusing on advanced packaging technology for multi-chiplet system-in-packages (SiPs). The latest government subsidies include more than ¥50 billion ($329.85 million) for research and development in this area, marking the first time Japan has provided subsidies for such technologies.
One notable aspect of the project is that Rapidus will utilize a section of Seiko Epson Corporation’s Chitose Plant for its back-end packaging processes. This plant is conveniently located near the company’s fab in Bibi World, an industrial park in Chitose City where pilot-stage research and development activities will take place. Through collaborations and financial support, Rapidus is confident in its ability to revolutionize the semiconductor industry with its cutting-edge technology.
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