Samsung is currently exploring different processor options for its upcoming Galaxy S25 series flagship, according to recent reports. Earlier speculations suggested that the series might use the Exynos 2500 processor in some regions, potentially even surpassing the Snapdragon 8 Gen 4 processor. However, a new report from TheElec indicates that Samsung is working on a new heatsink technology to tackle overheating issues in future Exynos chipsets.
The current Exynos 2400 processor is powerful but has faced challenges with throttling and higher temperatures compared to Qualcomm Snapdragon chips. To address these concerns, Samsung is developing a new chip-packaging technology known as fan-out wafer-level package-HPB (FOWLP-HPB). This technology involves implementing a heat path block (HPB) heatsink on top of the processor, which aims to enhance heat dissipation. Initially used in PCs and servers due to their larger size, this technology is now being adapted for smartphones due to their compact dimensions.
Samsung’s Advanced Package (AVP) business within its chip division is leading the development effort and expects to finalize the technology by Q4 2024, with mass production set to follow shortly after. While this new heatsink technology aligns with rumors that the Exynos 2500 chipset might power the Galaxy S25 series, there have been conflicting reports about Samsung’s processor choices. Some sources suggest a switch to MediaTek due to yield issues, while others hint at Qualcomm becoming the exclusive chip supplier for the Galaxy S25 lineup.
As industry analysts continue to speculate about Samsung’s future flagship devices, there are also talks of streamlining its Galaxy S series lineup by discontinuing Plus models and possibly incorporating three different chips in varying combinations. With so many possibilities on the table, consumers and tech enthusiasts eagerly await official announcements regarding Samsung’s next big move in mobile technology.
